To address this challenge, Akusense has designed a PCB automation detection solution for users that integrates high-resolution imaging, intelligent algorithm analysis, and automated process control.

solution

1. Ultra high definition imaging technology: Using a 12 megapixel, 4000 * 3000 resolution color camera, combined with a 16mm polarizer, it can capture every subtle line sequence, chip, and solder joint detail on the PCB board. Even under complex lighting conditions, it can ensure clear and non reflective images, providing a foundation for precise analysis in the future.

2. Multi dimensional lighting system: equipped with dual illumination solutions of perforated surface light and polarized strip light, providing customized lighting effects for different detection needs. The perforated surface light provides uniform background illumination and enhances contrast; Polarized stripe light effectively reduces reflection in areas such as solder joints, allowing defects to be exposed.

3. Intelligent algorithm driven: Meiji's visual platform integrates a series of advanced image processing and analysis algorithms, including edge detection, feature extraction, template matching, color segmentation, shape recognition, and optional machine learning algorithms. These algorithms can automatically recognize and determine whether the line sequence on the PCB board is correct, whether the chip exists, and whether the solder joint quality is qualified, achieving seamless conversion from image to data.

4. Efficient automation process: Unified control of cameras, lighting systems, and possible automation platforms is achieved through conventional four-way digital controllers. The preset automation process can be started with one click, automatically completing image acquisition, data processing, and result output, greatly improving detection efficiency and reducing manual intervention costs.

5. Customized inspection report: The generated inspection report provides detailed records of the inspection time, inspection results (including defect type, location, and quantity information), and image evidence. Users can customize the report format and content as needed, providing strong support for quality traceability and product improvement.

Installation Diagram

1. Install the camera light source in the appropriate position and start debugging the camera

2. After the image acquisition is completed, single target feature matching can be directly used to locate features, to identify the presence or absence of chips and template size, and to prevent missing soldering or chip model soldering errors (due to the good quality of the lighting effect, no image processing is required)

3. Use three colored Blobs to identify the three wire sequence colors and prevent welding errors

4. Collaborate with PLC to label OK and NG products accordingly, completing the entire testing process

detection effect

① Line sequence recognition effect

Difficulty in detection: The black wire is consistent with the background, making it difficult to extract;

Solution: Crop the image and reduce the detection range; The product needs to be placed flat in the groove. Lifting it up can cause uneven imaging and affect recognition

② Is there any detection effect on the solder joints

Detection difficulty: Diversity of solder joint features Solution: Use deep learning algorithms to train multiple solder joint shapes for automatic recognition and classification

③ Does the chip have detection effect

Detection difficulty: Some chips are pure black or consistent with the background color, resulting in fewer feature points being extracted; The product is raised or not in the groove, resulting in uneven polishing; Solution: The incoming materials should be kept in the groove without any warping and evenly polished; Match and increase the distribution of sampling points to ensure stable matching;

In the field of electronic manufacturing, the progressiveness of technology and the reliability of the system are two wheels in a row. We are well aware that while technological leadership is important for PCB inspection, system stability and reliability are the cornerstone. Therefore, when designing this automated detection solution, we always prioritize the reliability of the technology.

In addition, Meiji also focuses on continuous optimization and upgrading of the system to cope with constantly changing detection needs and challenges. Through continuous technological innovation and algorithm optimization, the detection accuracy and efficiency of the system are improved, bringing more efficient and accurate detection experience to electronic manufacturing enterprises, and supporting users to become industry leaders.