In today's 3C industry, visual inspection of PCBs has become a common solution, greatly improving production efficiency and product quality. However, with the increasing complexity and diversity of electronic product design, especially for PCB applications with special colors or similar backgrounds and diverse detection objects, traditional visual inspection solutions are often inadequate.

In the face of these challenges, targeted solutions are particularly important. Akusense Sensing, with its profound accumulation and innovative technology in the field of visual inspection, has successfully developed a visual system that can flexibly respond to various complex detection tasks. In this issue, Xiao Ming is here to share~

A certain electronic manufacturing customer needs to simultaneously complete three major tasks on the PCB board production line: line sequence color recognition, solder joint defect detection, and chip presence detection. Traditional manual inspection is inefficient and prone to missed detections. We have designed a high-precision and high-efficiency visual system that integrates traditional image processing and deep learning techniques to achieve full process automated detection

1. Ultra high definition imaging technology: Using a 12 megapixel, 4000 * 3000 resolution color camera, combined with a 16mm polarizer, it can capture every subtle line sequence, chip, and solder joint detail on the PCB board. Even under complex lighting conditions, it can ensure clear and non reflective images, providing a foundation for precise analysis in the future.

2. Multi dimensional lighting system: equipped with dual illumination solutions of perforated surface light and polarized strip light, providing customized lighting effects for different detection needs. The perforated surface light provides uniform background illumination and enhances contrast; Polarized stripe light effectively reduces reflection in areas such as solder joints, allowing defects to be exposed.

3. Intelligent algorithm driven: Meiji's visual platform integrates a series of advanced image processing and analysis algorithms, including edge detection, feature extraction, template matching, color segmentation, shape recognition, and optional machine learning algorithms. These algorithms can automatically recognize and determine whether the line sequence on the PCB board is correct, whether the chip exists, and whether the solder joint quality is qualified, achieving seamless conversion from image to data.

4. Efficient automation process: Unified control of cameras, lighting systems, and possible automation platforms is achieved through conventional four-way digital controllers. The preset automation process can be started with one click, automatically completing image acquisition, data processing, and result output, greatly improving detection efficiency and reducing manual intervention costs.

5. Customized inspection report: The generated inspection report provides detailed records of the inspection time, inspection results (including defect type, location, and quantity information), and image evidence. Users can customize the report format and content as needed, providing strong support for quality traceability and product improvement.

1、将相机光源安装至合适位置开始调试相机

2、图像采集完成后，可以直接使用单目标特征匹配来定位特征（因打光效果质量较好，无需做图像处理）

② 焊点有无检测效果

③ 芯片有无检测效果