In the pan semiconductor industry, intelligent manufacturing of wafers can be done in this way
In the pan semiconductor industry, intelligent manufacturing of wafers can be done in this way
We have created high-quality products and solutions for various segmented scenarios, achieving intelligent integration with production lines and quality inspection lines, enabling wafer manufacturing plants to achieve intelligent quality inspectionIn recent years, the application of integrated circuits has shown diversified development. The demand for chips in emerging fields such as smartphones, the Internet of Things, automotive electronics, high-performance computing, 5G, and artificial intelligence has grown exponentially, and higher requirements have been put forward for the quality and reliability of chips.
At the same time, due to the trend of product miniaturization, the size of wafers continues to shrink, and defects become even smaller, posing greater challenges to the wafer production process. In order to reduce the occurrence of defective products in the subsequent packaging process, defect inspection and size measurement of chips during the production process have become key technologies for providing high-quality chips and improving product yield.
Akusense Sensors has created high-quality products and solutions for various segmented scenarios, achieving intelligent docking with production lines and quality inspection lines, enabling wafer manufacturing plants to achieve intelligent quality inspection, helping to achieve a leap in detection efficiency and accuracy, covering up to 12 types of defect detection for products, and rapidly promoting manufacturers to achieve intelligent transformation!
▲缺陷定位算法体系
▲缺陷像素级分割算法体系
▲缺陷多分类算法体系
Application scenario
Wafer size measurement
Wafer appearance inspection
Wafer inbound and outbound management
Solution Advantages
⬆ High precision measurement
Cooperate with high-precision line scanning cameras to scan large format wafers multiple times and measure the corresponding dimensions.
⬆ High precision algorithm segmentation capability
In the fine segmentation of subtle defects, the ultimate 4-pixel defect detection can be achieved.
⬆ High stability visual contour extraction
For the difficult problem of defect detection in industrial scenarios where the inspected object is completely similar to the background, high stability visual contour extraction can be achieved to detect difficult to detect defects such as dirt and dust clusters.
success cases
✅ A semiconductor giant company's sapphire LED wafer testing project is compatible with testing of different wafer specifications, with seamless system switching.
✅ A leading enterprise in East China has integrated the design and manufacturing of dynamic random access memory (DRAM) for silicon wafer defect detection. The algorithm detection accuracy is 99.5%, greatly reducing the project cycle.
✅ East China Semiconductor Technology Co., Ltd. - Silicon wafer defect detection project, efficiency increased by 50%, achieving 100% full inspection.
✅ The semiconductor chip counting project of a national top 100 electronic information enterprise has achieved chip detection and counting with an accuracy rate of 98.5%.
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Akusense Technology Co., Ltd.